Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment
Key Specifications/Special Features:
| Number of layers : | 4layer |
| Base-material : | Shengyi FR4TG150 |
| Thickness : | 1.20 mm+/-10% |
| Final-Cu : | 70um |
| Blind and buried via : | Yes |
| Min. Drill hole : | 0.4mm |
| Min. Line space : | 0.6mm |
| Min. Line width : | 0.6mm |
| Mech. treatment : | Routing +v-cuting |
| Surface treatment : | Immersion tin |
| Solder-mask : | Red |
| Legend-Print : | white |
| 100% E-test : | Yes |
Products Application:
Our products are widely used in consumer electronics products,network, computer peripheral products,optoelectronic products,power supply products, electronic components,electrical mechanical products and so on.
Lead Time:
| Types | (Max ㎡/month) | Samples (days) | Mass Production(days) |
| New PO | Repeat PO | Urgent |
| 2layer | 50000 sq.m/month | 2-3 | 10-11 | 8-9 | 4 |
| 4layer | 5-6 | 11-12 | 9-11 | 5 |
| 6layer | 6-7 | 13-14 | 12-14 | 6 |
| 8layer | 7-8 | 16-18 | 14-15 | 7 |
Main Export Markets:
- Asia : Main 2-8layer
- Australasia : 2--10layer
- North America : 4layer over
- Western Europe : 4--12layer
Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
FAQ:
1. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
2. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
3. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
6. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.
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